Skip to main content

Temperature inversion

 What is Temp Inversion?

As the temperature increases, the delay of the cell can

  • Decrease due to decrease in threshold voltage (Vt).
  • Increase due to decrease in the mobility.

The dominating impacts of mobility and threshold voltage (Vt) determine the ensuing thermal trend associated with temperature inversion effects, which can cause a cell's delay to either increase or decrease.

The threshold voltage drop brought on by temperature change is minimal if the gate overdrive voltage (Vdd - Vt) is high. However, the mobility effect predominates, which causes the gate's delay to increase as the temperature rises.

But, if Gate overdrive voltage (Vdd - Vt) has reduced such that the decrease in threshold voltage effect dominates and delay decreases with the increases in temperature.

 below nodes, the threshold voltage (Vt) has not been reduced much but the supply voltages has reduced considerably to cater low leakage power concerns. The result is that the gate overdrive voltage (Vdd - Vt) has reduced and thus more prominent temperature inversion effects are observed.

Fig 1: Temperature inversion at different voltages and for different Vt flavors.

From the above graph, it is clear that Temp. Inversion effect tends to come into picture at lower voltages with more prominent effect on Higher Vt cells. Temp. Inversion effect will be more in lower technology nodes.

Fig 2: Temperature Inversion effect @different input transitions for HVT cell

Traditional Approach: High Vt cells are used to refine the design initially for greater power optimization, and then Low Vt cells are revealed for incremental timing optimization in the timing critical path alone. More design variation and power consumption will result from the HVT cell (High Vt, which is most prone to variation) driving the LVT logic.

Proposed Approach using Intelligent Vt structuring: Structuring is such that wherever High Vt cell is driving Low Vt cell, replace that occurrence with Low Vt cell driving the High Vt cell without degrading:-

  • Slew values.
  • Timing.
  • Leakage Power.

Fig.3: Traditional vs Proposed Approach

Below are the analysis results on the cell level implementation of the above described approaches.

Fig.4: Cell level results comparison for Traditional vs Proposed Approach

Design Implementation Algorithm:


Better Transition in design would :-

  • Suppress the effect of temperature inversion.
  • Help to meet higher frequency targets.
  • Reduce the internal power.

But better transition would require high drive strength or more Low Vt cells or more redundant buffers in the design which leads to: -

  • More leakage power.
  • More switching power.

This increase in power is not acceptable!!!

Comments

  1. Cualquier persona que busque un corredor de bolsa confiable para invertir puede contactar al Sr. Cusano por WhatsApp al +393510140339 o por correo electrónico a broker_cusano@outlook.com. El Sr. Cusano me ayudó a invertir 1300$ y hoy mi inversión ha aumentado a 23000$ después de dos semanas. Estoy muy agradecido por esta oportunidad y me gustaría que cualquier persona que busque una oportunidad similar se ponga en contacto con él para obtener ayuda.

    ReplyDelete

Post a Comment

Popular posts from this blog

Revision session

 10 Years Experienced Physical Design – Rapid Fire 100 Questions Interview Killer Revision Round (Senior / Lead Level) Use these for Qualcomm / Apple / NVIDIA / AMD / Intel / TSMC interviews. Answer in 1–3 lines, confident and practical. ⸻ Floorplan (1–15) 1. What is ideal utilization? No universal value; depends on macros, routing demand, node, timing target. Common start point high-60s to low-70s. 2. Why low utilization can also be bad? Wastes area, increases wirelength, hurts timing, higher die cost. 3. What is macro halo? Keepout around macro for routing/access/placement margin. 4. Channel spacing decided by? Pin density, expected traffic, metal stack, bus width. 5. Why macro orientation matters? Pin alignment and routing efficiency. 6. What makes floorplan good? Short critical paths, balanced whitespace, clean PG, low congestion risk. 7. Why place macros first? They dominate routing and topology. 8. Why edge macro placement common? Frees center for standard-cell routing. 9. Wh...

ERC :ELECTRICAL RULE CHECK

 Today's most important topic in Backend vlsi signoff stage       ERC (electrical rule check) ERC involves checking a design for all electrical connection. Checks such as well and substrate area for proper contact and spacing ,unconnected input or shorted output and one more Gates should not connect directly to supply (Must be connected through TIE high/low cells only) Floating gate errors ,if any gate is unconnected .This could lead to leakage issues. The well geometries need to be connected to power /ground and if PG Connection is not complete or if the pins are not defined ,the whole layout can report errors like"NWELL is not connected to VDD"

QUESTION&ANSWERS

  Q 1: What are the goals of Synthesis ? There are Mainly three goals of synthesis without changing the functionality Reduce the area (chip cost reduce) Increase performance Reduce the power Q 2: What are the Tech dependent inputs in PNR There are three main tech depended inputs Physical libraries    -->format is .lef     --->given by vendors Technology file       -->format is .tf       --->given by fabrication peoples TLU+ file                   -->format is .TLUP-->given by fabrication people Q 3: What are the Design dependent inputs in PNR There are six main design depended inputs Logical libraries      --> format is .lib    --->given by Vendors Netlist             ...